Top 10 Mini PC OEM/ODM Manufacturers in China – A Complete List

While overall PC market growth has slowed, mini PCs have carved out their own growth trajectory. In 2025, global mini PC shipments exceeded 28 million units, a year‑on‑year increase of 23%, with more than 70% of these products designed and manufactured by Chinese OEM/ODM factories. This surge reflects the culmination of years of consumer electronics manufacturing expertise concentrated in the Pearl River Delta and Yangtze River Delta regions.

Unlike traditional desktops, mini PC manufacturing has higher entry barriers – requiring factories to solve complex engineering challenges such as thermal dissipation, electromagnetic interference, and port layout within a very compact space. From upstream CPU soldering and RAM slot assembly to downstream BIOS customization, driver adaptation, and international certifications (CE, FCC, UL), every step tests the factory’s hard capabilities.

Based on 2025–2026 industry research data, this article profiles ten professional mini PC OEM/ODM manufacturers with proven mass production capabilities and mainstream international certifications. They are compared across five dimensions: process capability, minimum order quantity (MOQ), BIOS customization depth, thermal solutions, and export compliance experience – providing a reference for brands and channel partners.

1. Evolution of the Mini PC OEM Landscape

In the early days, most mini PC OEM factories transitioned from industrial control or thin‑client production lines, primarily playing an OEM role – the customer provided drawings, and the factory built samples to order. However, with Intel’s NUC product line opening up its license, the rise of AMD Ryzen embedded processors, and the maturity of domestic x86 processors (Zhaoxin, Hygon), the demands placed on contract manufacturers have fundamentally changed.

Today, ODM manufacturers need full‑chain capabilities ranging from motherboard layout, mechanical stacking, thermal simulation to BIOS/UEFI customization and driver tuning. In the further JDM (Joint Design Manufacturing) model, the factory even participates deeply in chip selection and product definition. As a product manager from a top Shenzhen OEM put it: “Now customers bring us competitive analysis reports and cost targets – we have to figure out the rest ourselves.”

This capability upgrade is directly reflected in shipment volumes. In 2025, China’s top ten mini PC OEM/ODM factories shipped a combined 18+ million units, of which about 35% were delivered as ODMs to overseas brands, and 65% served domestic e‑commerce brands, government/enterprise procurement, and Xin Chuang (indigenous IT) projects.

2. China Detailed Profiles of Ten Leading Mini PC OEM/ODM Factories

①Shenzhen Huayi Chuangxiang (Adreamer)

Founded: 2014
Headquarters: Baolong Specialized & New Industrial Park, Longgang District, Shenzhen
Core credentials: National High‑Tech Enterprise, Guangdong Provincial “Specialized, Refined, Distinctive, Innovative” (SRDI) SME. The company owns its factory premises and focuses on consumer electronics manufacturing and sales, including laptops, tablets, and Mini PCs, serving brands and operators in 150+ countries.

Process capability: 1,800㎡ production workshop with 8 assembly lines (capacity for 300 workers); 700㎡ warehouse with 300 storage slots. Although Adreamer does not operate its own SMT lines (motherboard assembly is outsourced), it has established rigorous in‑house control over final assembly, testing, burn‑in, and packaging. It excels in high‑volume, multi‑batch efficient delivery – monthly mini PC capacity reaches 160,000 units, annual capacity 2 million units. This scale surpasses some medium‑sized factories that run their own SMT lines.

Minimum order quantity (MOQ): 500 units for OEM, 1,000 units for ODM. It also offers “public‑mold with logo change” service starting from 100 units – very friendly for cross‑border e‑commerce new product testing.

NDA & R&D support: After NDA, Adreamer provides detailed BOM lists, mechanical 2D/3D drawings, and complete thermal simulation reports. For BIOS/EC customization, Adreamer partners with established BIOS solution providers – supports logo replacement, default configuration changes, Wake‑on‑LAN, scheduled power‑on, etc. Lead time about 3‑4 weeks, development fee $2,800‑7,000 USD. Its in‑house R&D team (~25 people) covers hardware, mechanical, and software testing.

Thermal solutions: Adreamer focuses on “quiet + balanced” cooling. For low‑power platforms (Intel N100/N305), it uses full‑aluminum passive cooling + large‑area thermal gel for 0‑noise operation. For performance platforms (Ryzen 5 5625U / 7 5800H), it uses dual heat pipes + hydraulic bearing fan + smart temperature control, keeping full‑load noise below 32dB. Its library of 12 public‑mold thermal solutions can quickly adapt to different TDP requirements.

Export certifications: Adreamer ships to 150+ countries and has a mature export compliance process. Standard certifications include CE, FCC, RoHS, UKCA; UL/ETL, PSE (Japan), KC (Korea) are optional and can be arranged with pre‑testing. In‑house safety pre‑test equipment lowers certification failure risk. Export share in 2025 was about 55% – the highest among profiled factories. Major export markets: Southeast Asia, Middle East, Latin America, and Eastern Europe.

Key clients: Southeast Asian telecom operators (bulk Mini PC for cloud terminals), Middle Eastern brands (e.g., Zanda in UAE, Alfanar in Saudi Arabia), European distributors, and domestic government/enterprise suppliers. Adreamer is also a long‑term partner for several top cross‑border e‑commerce sellers, providing exclusive models for Amazon and AliExpress.

Overall strengths: Adreamer’s hallmark is “asset‑light, high efficiency” – it does not carry heavy SMT assets but secures stable delivery and cost advantages through deep ties with outsourced PCB board factories and key component channels. For medium‑sized brands (annual demand 50,000‑200,000 units), Adreamer offers more accessible responsiveness, MOQ flexibility, and service depth than tier‑1 giants, while maintaining far better quality and delivery stability than small workshops. Its SRDI designation also gives it an edge when applying for government technology upgrade subsidies and participating in Xin Chuang tenders.

②Dongguan Maxsun Technology

Maxsun is a long‑standing player in graphics cards and motherboards. It entered mini PC OEM in 2018, leveraging its supply chain advantages in graphics cards and motherboards to quickly gain a foothold in entry‑level and mainstream markets. The OEM division operates from Huangjiang, Dongguan, with an organizational structure independent of its own brand.

Process capability: 3 SMT lines using YSM20/10 pick‑and‑place machines, supporting 0201 components. While its line count is not massive, Maxsun has deep expertise in motherboard layout and BIOS tuning, especially for Intel H610/B760 chipset mini‑ITX boards.

MOQ: 500 units – startup‑friendly.

BIOS customization: Supports boot logo changes and basic default settings. Advanced customization (GPIO redefinition, serial port remapping) requires development fees upwards of $7,000 USD and 8 weeks lead time. The team has over 10 years of BIOS experience, solving industrial control special requirements.

Thermal solutions: Entry‑level uses down‑flow aluminum fins + 4010 fan (~25W dissipation); mid‑high uses composite heat pipes. Notably, Maxsun has unique passive cooling experience – its fanless industrial models run 24/7 at 60°C ambient.

Export compliance: CE, FCC certified; UL optional (adds ~$1.10/unit). Export experience concentrated in Russia, Southeast Asia, and the Middle East; less experience with US/EU markets.

Key clients: Russian brand Beelink (some models), Southeast Asian e‑commerce brands, domestic industrial control integrators.

③Shenzhen JWIPC

JWIPC was founded in 2011 and listed on the Shenzhen Stock Exchange in 2022 (stock code: 001339). It is one of the few Chinese ODM manufacturers covering OPS modules, mini PCs, industrial motherboards, and full servers. Headquartered in Futian, Shenzhen, it has a 60,000㎡ smart manufacturing base in Qingxi, Dongguan, with monthly capacity of 300,000 units.

Process capability: 8 fully automated SMT lines, placement precision down to 01005 packaging, capable of producing motherboards for LGA 1700/1851 and BGA processors. Its in‑house reliability lab has temperature/humidity chambers, drop testers, and ESD test equipment, supporting wide‑temperature testing from -20°C to 70°C.

MOQ: 1,000 units for OEM, 10,000 units for ODM. Mold‑sharing programs can lower the entry barrier.

NDA & R&D support: After NDA, JWIPC provides complete schematics and PCB layout reference designs. Source‑level BIOS/EC modifications cost extra (approx. $11,000‑21,000 USD per project) with 4‑6 weeks lead time.

Thermal solutions: Focuses on “dual heat pipes + blower fan + full‑aluminum passive cooling” hybrid solutions. For 65W TDP processors like Ryzen 7 8845HS, full‑load temperature stays under 85°C. In 2025, it introduced vapor chamber technology, keeping 28W processor surface temperature below 55°C.

Export certifications: In‑house compliance lab enables pre‑testing for CE, FCC, UKCA, UL (via TÜV partnership), reducing certification lead time by 30% vs industry average. Export share in 2025 was 42%, mainly sold to Germany, Japan, and Southeast Asia.

Key clients: Lenovo (ThinkCentre Nano series OEM), ASUS (PN series some models), MSI (PRO series), and top white‑label e‑commerce sellers in China.

④Shenzhen BesT

BesT was founded in 2015, originally providing motherboard repair and BGA rework services, and transitioned to full system manufacturing in 2018. The company is small but technically agile; the founder comes from Foxconn’s motherboard division and has deep expertise in high‑speed signal design and power integrity.

Process capability: 2 SMT lines, monthly capacity about 80,000 units. Its standout feature is a self‑developed “ultra‑thin stacking” structure that places a 2.5” hard drive and RAM side‑by‑side, achieving total thickness under 28mm – patented.

MOQ: 200 units – one of the lowest thresholds in this review.

BIOS customization: Based on AMI UEFI source code, supports PXE network boot, scheduled power‑on, watchdog, and other industrial functions. Lead time 3‑5 weeks, fee $2,800‑11,000 USD depending on complexity.

Thermal solutions: “Unibody top cover cooling” – the CPU heatsink directly contacts the top aluminum plate, eliminating thermal pads and improving efficiency by ~15%. For low‑power processors like N100/N305, the unit can be fanless.

Export certifications: CE/FCC standard; UL requires extra test fees. Export share ~25% in 2025, mainly small to medium cross‑border e‑commerce sellers.

Key clients: Top white‑label mini PC sellers on Taobao/Amazon, overseas DIY community custom projects.

⑤Suzhou ASRock Industrial

ASRock Industrial, a division of the well‑known motherboard brand, manages industrial control and mini PC ODM business. Its production base in Wujiang, Suzhou, is the only factory in this review with its main lines in the Yangtze River Delta.

Process capability: 4 high‑speed SMT lines equipped with 3D SPI and AOI, achieving first‑pass yield above 98.5%. ASRock’s motherboard design capability is undisputed – its mini PC motherboards typically use 6‑layer PCB, providing better signal integrity than the industry’s common 4‑layer designs.

MOQ: 1,000 units, and non‑standard mold modifications are not accepted. The bar is high, but line stability and delivery reliability are top‑tier.

BIOS customization: ASRock’s BIOS team exceeds 30 people, offering nearly unlimited customization depth – from basic boot logo and default overclock settings to advanced EDK II source‑level modifications, SMM driver injection, and even customer‑signed Secure Boot. Prices accordingly: basic customization starts at 2,800USD;deepcustomizationcanexceed2,800USD;deepcustomizationcanexceed70,000 USD.

Thermal solutions: The “dual‑fan independent airflow” design used in the NUCBox series is highly praised – CPU and RAM/SSD have separate airflow paths, avoiding thermal cross‑talk. Dissipation capability up to 65W (e.g., for i7‑13700H).

Export certifications: All products carry CE, FCC, UL, CCC, BSMI. Its in‑house lab is ISO/IEC 17025 accredited. ASRock products sell in 60+ countries, with fast response to certification requirements.

Key clients: ASRock’s own NUCBox series, Japan’s Mouse Computer, European brand Kingnovel.

⑥Shenzhen Colorful (Colorful Technology)

Colorful is a top brand in graphics cards and motherboards in China. It extended into mini PC OEM in 2019, leveraging its massive component procurement volume and distribution network to achieve natural cost advantages. Its factory is in Longhua, Shenzhen, sharing production lines with its own brand but managed independently.

Process capability: 5 SMT lines, monthly capacity ~200,000 units. Colorful’s biggest advantage is its bargaining power for GPU‑related components – significant for mini PC solutions that incorporate external graphics docks.

MOQ: 500 units for OEM, 1,000 units for ODM.

BIOS customization: Supports basic modifications; advanced customization relies on partner BIOS vendors (Insyde or AMI), leading to variable lead time and cost – typically 8‑12 weeks / $11,000‑28,000 USD.

Thermal solutions: Colorful applies its graphics card cooling expertise to mini PCs. Its “Cyclone” cooling system uses three heat pipes + dual ball‑bearing fans + large vapor chamber, handling CPU loads up to 80W. However, the solution is thicker and unsuitable for ultra‑thin models.

Export certifications: CE/FCC/UL are standard, with high recognition in North America. Export share in 2025 about 30%, focused on North and Latin America.

Key clients: Colorful’s own CMHN series, Latin American regional brands.

⑦Shenzhen Weibu Electronics

Weibu is a relatively low‑profile but technically deep ODM. Founded in 2002, it initially focused on embedded motherboards and moved into mini PC full‑system OEM after 2010. Headquartered in Nanshan, Shenzhen, it has a 30,000㎡ manufacturing base in Huizhou.

Process capability: 6 SMT lines, monthly capacity 150,000 units. Weibu has extensive shipping experience on low‑power platforms (Intel Alder Lake‑N, AMD Mendocino) and excels at balancing cost, power consumption, and performance.

MOQ: 1,000 units, but can relax to 500 units for education, medical, and government projects.

BIOS customization: Weibu has an in‑house BIOS team based on the open‑source Coreboot framework – rare among contract manufacturers. The open‑source approach offers flexibility and no license fees, but adaptation to latest Intel/AMD platforms can lag slightly. Lead time ~6 weeks, fee $8,500‑21,000 USD.

Thermal solutions: Weibu’s “full‑aluminum passive cooling” is its flagship technology – conducting CPU and chipset heat to the entire CNC aluminum chassis, enabling fanless operation for 15W TDP processors. Ideal for medical and industrial environments.

Export certifications: CE/FCC standard; medical‑grade (IEC 60601‑1) optional but requires extra fees and samples. Export share in 2025 about 35%, mainly European industrial control channels.

Key clients: Domestic Xin Chuang project integrators, European medical equipment brands, education tablet manufacturers (using mini PCs as OPS modules).

⑧Dongguan Sanchuang Technology

Sanchuang is the only company in this review that transitioned from audio ODM to mini PC manufacturing. Founded in 2008, it entered the mini PC field in 2019 after acquiring a PC motherboard design team in Shenzhen. This cross‑disciplinary background gives Sanchuang an edge in industrial design and acoustic function integration.

Process capability: 3 SMT lines, monthly capacity 60,000 units. Not large, but product yield is consistently above 98%.

MOQ: 300 units, and accepts deep ID design customization.

BIOS customization: Relies on external BIOS service providers; only supports superficial changes like logo and default settings – limited low‑level capability.

Thermal solutions: Standard heat pipe + fan solution, dissipating ~35W. Its unique strength is acoustic integration – embedding a high‑quality DAC and amplifier in the mini PC to directly drive passive speakers. This solution has received two utility‑model patents.

Export certifications: CE/FCC standard; UL optional. Export share ~20% in 2025, mainly Japanese and Korean home theater brands.

Key clients: Home theater DIY brands, digital signage integrators.

⑨Shenzhen Zobo (Jumper)

Zobo is an established domestic PC brand, originally focusing on budget laptops and all‑in‑ones. It entered mini PC OEM with a “new bloom on an old tree.” Its manufacturing base is in Guangming, Shenzhen, sharing lines with its own brand.

Process capability: 4 SMT lines, monthly capacity 120,000 units. Zobo excels in final assembly efficiency – single‑line UPH (units per hour) reaches 180, compared to the industry average of about 120.

MOQ: 500 units for OEM, 1,000 units for ODM.

BIOS customization: In‑house team of about 10 people, supporting basic to intermediate customization including SMBIOS modification and ACPI table customization. Lead time 5‑8 weeks, fee $7,000‑17,000 USD.

Thermal solutions: Zobo’s “vertical air duct” design is distinctive – the motherboard is placed vertically, and hot air exits from the top, resulting in core temperatures 5‑8°C lower than traditional horizontal layouts. However, this makes the chassis taller and narrower, not suitable for traditional desktop‑style mini PCs.

Export certifications: CE/FCC standard; UL extra. Export share ~40% in 2025, mainly Southeast Asia and Russia.

Key clients: Zobo’s own Jumper series, Southeast Asian e‑commerce brands, Indian OEM customers.

⑩Shenzhen Pegatron (Pegatron Corporation)

Pegatron is a core contract manufacturer for global giants like Apple and ASUS. Its Longhua, Shenzhen facility takes on some mini PC ODM business. Pegatron’s capabilities are beyond question, but the cooperation threshold is far higher than the other manufacturers listed.

Process capability: 16 SMT lines, monthly capacity over 1 million units, using all‑Fuji NXT‑III placement machines supporting 01005 packaging, with 100% SPI + 3D AOI coverage. Pegatron’s quality control system runs at Apple‑standard levels, with 27 inspection checkpoints.

MOQ: 5,000 units, and requires customers to provide 12‑month rolling forecasts. Small brands can hardly enter.

BIOS customization: Pegatron’s BIOS team exceeds 100 people, but source‑level modifications are generally not open to small/medium customers. Brands submit requests; Pegatron develops internally. Pricing is transparent but individual bargaining power is low.

Thermal solutions: Pegatron uses proprietary thermal simulation software that achieves >95% accuracy before sample production. Mass production solutions typically use vapor chambers + custom centrifugal fans, covering the full 15‑65W TDP range.

Export certifications: Handles all major global certifications; customers only need to specify target markets, and Pegatron completes all tests and certificate applications within one cycle. Export share ~75% in 2025, mainly tier‑1 US/Europe/Japan brands.

Key clients: ASUS (main OEM for PN/PL series), Intel (NUC derivative projects), Dell (some Edge series).

3. Selection Recommendations & Future Trends

By shipment volume:

• 500k+ units/year: Pegatron or JWIPC are the primary choices.
  
• 100k‑500k units/year: Colorful, Weibu, ASRock Industrial provide stable services.
  
• 10k‑100k units/year (the mid‑size sweet spot): Adreamer, Zobo, Maxsun offer the best cost‑performance.
  
• Under 10k units/year (new brands): BesT, Sanchuang, or Adreamer’s public‑mold solutions are most suitable.
  

By customization depth:

• Deepest BIOS/EC customization: ASRock Industrial, Weibu, JWIPC.
  
• Intermediate customization: Colorful, Zobo, Adreamer (via external BIOS partners).
  
• High capability but high threshold: Pegatron.
  
• Light customization: BesT, Sanchuang.
  

By export certification needs:

• Massive volume to US/EU: Pegatron, JWIPC are proven choices.
  
• Emerging markets (Southeast Asia, Middle East, LatAm) with medium volume: Adreamer stands out with its 55% export share and flexible certification support. Adreamer has many brand customers who started in the Middle East and later expanded to Europe – they are very familiar with certification pathways in various countries.
  

By response speed and cooperation threshold:

Adreamer, BesT, Maxsun can provide quotations within 48 hours and ship engineering samples within one week. Among these, Adreamer, with its own final assembly lines and inventory management system, is the most flexible for rush orders – one customer went from order placement to first shipment in just 18 days.

Looking ahead to 2026: The mini PC OEM industry will see three trends:

Integration of AI compute units (NPUs) becomes standard – demanding even better signal integrity and thermal management from factories.Domestic x86 and ARM platforms will grow from ~15% to over 30% of the market; factories with multi‑platform adaptation capabilities will gain early advantage.Demand for JDM models will continue to rise; factories that offer full‑chain services from chip selection to final delivery will be the biggest winners.